Metallized ceramics are composite materials that combine metal and ceramic through a specific process. They combine the high hardness, high-temperature resistance, and corrosion resistance of ceramics with the electrical conductivity and machinability of metals. Their core technology lies in achieving reliable bonding between Ceramic to Metal and metal through surface modification. They are widely used in fields such as electronic packaging, energy, and aerospace. The following is a comprehensive analysis of the technical principles, application scenarios, industry status, and development trends:
Technical Principles and Process Classification
The preparation of Metallization Ceramics requires addressing issues such as the difference in thermal expansion coefficients between ceramic and metal, as well as insufficient interfacial bonding strength. Mainstream processes include:
1. High-Temperature Co-Firing (HTCC/LTCC): The Alumina Metallized Ceramics green body and metal conductor are simultaneously sintered at high temperatures to form an integrated structure. This is suitable for high-frequency circuit substrates.
2. Direct Bonded Copper (DBC): This method directly bonds copper foil to the metallized ceramic components substrate through high-temperature melting. This method offers high thermal conductivity (reaching over 200 W/m·K) and is primarily used in power device packaging.
3. Active Metal Brazing (AMB): Utilizing brazing filler metals containing active elements such as titanium to form a metallurgical bond on the ceramic metallization surface, achieving a metal layer bond strength exceeding 15 N/mm², this process is the mainstream for silicon nitride substrates.
4. Sputtering-Electroplating Composite (SBC): A seed layer is formed through vacuum sputtering, followed by a thickened metal layer through electroplating, achieving "zero-pore" metallization. Bond strength exceeds 30 N/mm² and is compatible with a variety of metallized alumina ceramics materials.
Core Performance and Applications
The performance advantages of metalized alumina have earned them a prominent position in high-end manufacturing:
High Thermal Conductivity: Aluminium nitride substrates offer a thermal conductivity of 180-270 W/m·K, significantly superior to traditional alumina substrates (20-30 W/m·K). They are widely used in 5G base station RF devices and new energy vehicle IGBT modules.
High Insulation: With an insulation resistance exceeding 10¹²Ω at high voltages exceeding 1000V, they are suitable for high-voltage power transmission equipment and avionics control systems. Extreme Environment Resistance: Withstands temperature cycles from -196°C to 200°C, maintaining stable performance in high-temperature components of aircraft engines and deep space exploration equipment.
Typical Application Scenarios:
1. Semiconductor Packaging: Serves as a chip carrier and heat sink, supporting high-density integration of advanced process chips.
2. New Energy: Silicon nitride substrates for IGBT modules are core components of new energy vehicle motor controllers, directly impacting vehicle energy efficiency.
3. Aerospace: Rocket engine combustion chamber linings and satellite power modules utilise alumina ceramic components to withstand extreme temperatures and vibration.
4. Industrial Automation: High-temperature sensors and precision instrument components rely on their stability.
As a key material for high-end manufacturing, metallized ceramics' technological breakthroughs and industrial upgrades are of great significance to the independent and controlled development of China's strategic emerging industries. With the advancement of domestic production and the continuous expansion of application scenarios, this sector is expected to achieve a leap from "following" to "running alongside" and even "leading" within the next decade.
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